How Quick Dump Rinsers Improve Silicon Wet Etching Process

Quick dump rinsers provide fast and effective rinsing of silicon wafers from chemicals and particles. During semiconductor fabrication silicon wafers are etched with chemicals and particles, which have to be rinsed off to prevent continued etching.

Modutek's quick dump rinser uses de-ionized water to wash away all traces of chemicals while introducing no new particle contamination source. It uses state-of-the-art engineering techniques that allow it to reduce de-ionized water consumption while featuring a short rinsing time and particle reduction. The large trap door and the contoured rinsing vessel shorten dump times and promote laminar flow to rinse away contaminants. The machined dump door doesn't have any seals or gaskets that could entrap particles, and the smooth polypropylene construction of the tank ensures that it is not a source of new particle contamination.

Once the silicon wafers are placed in the rinser, de-ionized water jets rinse the chemicals from the wafer surfaces. The tank fills, bringing the rinsed contaminants to the surface where they leave the tank through the overflow weir. A nitrogen bubbler produces gas bubbles that rise through the water and remove additional particles and contaminants. At the final stage of the rinse cycle, the trap door at the bottom of the tank opens to drain the water.

The entire rinsing process is fast and thorough without introducing new contamination. The use of Modutek's quick dump rinsers can improve production and output quality. When quick dump rinsers work rapidly, effectively removing chemicals, particles, and contaminants leads to an increase of throughput and reduced chances of product rejection.

Rinsing is required after most of the wet process production steps, and any time saved with a quick dump rinser is multiplied by the number of times rinsing takes place in the semiconductor production process. Modutek's quick dump rinser provides these benefits by addressing overall semiconductor manufacturing requirements.

Modutek's quick dump rinsers provide additional benefits, such as reduced costs and faster production line operation. Reduced de-ionized water lowers costs, and an optional reclaim system can result in extra savings. Besides quick dump rinsers, Modutek also supports customers with full line of standard or customized silicon wet etching equipment.

For more details read the complete article, How Quick Dump Rinsers Improve Silicon Wet Etching Process. If you have questions, or would like to set up a free consultation, call 866-803-1533 or email modutek@modutek.com.

How the Silicon Nitride Wet Etching Process Is Improved by Modutek

Silicon nitride is used as a mask when etching silicon wafers as part of the semiconductor manufacturing process. Before the silicon wafer goes to the next fabrication steps, the silicon nitride needs to be removed from the wafer surface using a solution of DI water and phosphoric acid.

To optimize the silicon nitride wet etching process, the phosphoric acid solution is kept at a high temperature. This means some of the DI water boils off as steam and must be replaced. Adding water to the phosphoric acid is extremely dangerous as it can explode. Keeping the solution at a constant temperature is essential for accurate control of the stripping process.

Modutek has made significant improvements to both the safety and the control of the nitride wet etching process with its Nb series silicon nitride wet etching baths. Here, the heater that boils the solution is always switched on, which leads to the solution being heated up to the boiling point and further heating will not increase the temperature, just the boiling rate.

Just in case the temperature increases, a thermocouple in Modutek's bath gives the signal that the DI water should be added. Then, the DI water is added slowly to the boiling solution (since the acid boils rapidly) to make sure that it's mixed in immediately and doesn't form a water film on the solution's surface. If the water is added to the solution too quickly, the water film will form and mix itself with the acid, which leads to a very strong reaction and an explosion is possible.

This control strategy employed in Modutek’s system ensures the temperature of the solution is always maintained at its boiling point.Modutek’s silicon nitride wet etching baths also have additional safety features which ensure that no water is added if the solution is not boiling. Using its advanced control system with additional safety interlocks, Modutek has improved the accuracy, control and safety of the silicon nitride wet etching process.

For more details read the complete article titled “How the Silicon Nitride Wet Etching Process Is Improved by Modutek”. If you have questions or would like further information, please call Modutek at 866-803-1533 or email to modutek@modutek.com. 

How to Improve Your Silicon Wet Etching Process

The silicon wet etching processes used by fabrication facilities and research labs needs to deliver quality results in a consistent way.  The processes involved in semiconductor manufacturing include multiple steps that include cleaning, masking, and etching. These processes involve the use of various chemical baths, each of them intended to achieve a different and specific result. At the end of these accurately implemented processes, the silicon wafers that have been etched will be ready for testing.

Among the different requirements for an error-free process, the two primary ones include: 1) accurate monitoring over the speed at which the etching is done; and 2) the ability to achieve extreme levels of cleanliness in work areas in which etching is being done.

There are many ways to improve the silicon wet etching process, these include:

1)      Silicon nitride – Silicon nitride is applied to mask parts of wafers during the phosphoric acid etching process. A greater precision is a must in this process to attain superior results.

2)      Potassium hydroxide – The use of potassium hydroxide solution is required in the creation of microscopic structures on semiconductor wafers. Close monitoring over the concentration of the solution, the temperature, the orientation of the silicon crystal and silicon purity are required to achieve error-free and precise etches.

3)      Buffered oxide etch – This process uses hydrofluoric acid apart from the buffering agent to etch fine masking films of silicon oxide or silicon nitride.

When it comes to improving the silicon wet etching process, one of the most important factors is using high quality processing equipment from an experienced and reputable vendor that provides good support. With over 35 years of experience, Modutek Corporation is ready to answer this requirement not only by supplying the right silicon wet etching equipment, but also by advising its clients on which customizations are needed to match their requirements.

If you have questions about any equipment for silicon wet etching, read our recent article titled “How to Improve Your Silicon Wet Etching Process”. Contact Modutek by phone at 866-803-1533 or email modutek@modutek.com. 

Etching Silicon Wafers Without Hydrofluoric Acid

Hydrogen fluoride is an excellent etching chemical for silicon wet etching in wafer fabrication, etching rapidly to remove silicon oxide, for example, after an initial RCA clean. Although it is effective, hydrogen fluoride is toxic, dangerous and can be deadly if proper procedures are not followed.

Some of the dangers of exposure to hydrofluoric acid include:

• Vapor that can cause lungs to fill up with liquid
• Affects nerves at sites where the skin has been exposed to the acid and initially, the victims may feel a little pain as a result.
• Can penetrate deep into the body and destroy the tissues and bones. This often can cause long-lasting damage.
• Disrupts calcium chemistry of the blood, eventually leading to cardiac arrest.
• Even a small amount can cause skin burns that may be slow to heal. It can also result in death if treatment is delayed.

Hydrofluoric acid is also a hazardous waste and its discharge is tightly regulated. The acid must first be neutralized and the discharge limits on fluoride and metals must be followed. The safety and environmental considerations have resulted in the search for alternatives.

Depending on the specific silicon wet etching application, other etching chemicals may be used which are more suitable and safer replacements for hydrofluoric acid. Some of these include potassium hydroxide (KOH), tetramethylammonium hydroxide (TMAH) and nitride etch.

Modutek can help customers make the change by recommending equipment that supports an alternative chemical etchant. The company has over 35 years of experience and expertise in providing wet bench and wafer fabrication equipment and can advise customers about alternatives.

Read the complete article "Etching Silicon Wafers Without Hydrofluoric Acid" to get more details. If you have questions or would like a free quote or consultation, please contact Modutek at 866-803-1533 or email modutek@modutek.com.

Tips on Improving Your Silicon Wafer Etching Process

An Improved silicon wafer etching process requires careful selection of the right etching process for the application along with the use of high-quality reliable equipment that supports consistent results.

Wafer etching is a multiple step fabrication process that requires use of different chemical baths to achieve a specific desirable outcome: The process steps include cleaning, masking, etching wafer surfaces or depositing metal. These steps produce microscopic structures in the silicon wafer and produce the required electrical connections. Key factors that contribute to improving etching performance include control of the etching speed and the cleanliness of the fabrication environment. Etching processes typically used include the following:

·         Silicon nitride - is used as a masking material and is etched with a hot phosphoric acid.

·         Piranha etching - is done with a mixture of sulfuric acid and hydrogen peroxide.

·         KOH etching - using a solution of potassium hydroxide, this etching process creates microscopic structures in the silicon.

·         Buffered oxide etching (BOE) - is carried out with a solution of hydrofluoric acid and a buffering agent to etch thin masking films of silicon nitride or silicon dioxide.

Another key factor for improving silicon etching processes is to use wet process equipment from a reliable supplier that provides equipment that meets the specific application requirements. Modutek has over 35 years of experience as an equipment supplier and can advise customers on which equipment will meet all the requirements of their wafer etching application.

While choosing the right wafer etching process for each stage of semiconductor fabrication is important, the design characteristics of the equipment itself is also key to improving etching results. Modutek's etching equipment incorporates critical design features that include:

·         Filtration and flow control

·         Temperature control

·         Tank design

Semiconductor manufacturers and research labs need silicon wafer etching equipment that delivers accurate and repeatable results in a safe and reliable environment. Modutek helps customers improve their silicon wafer etching process by advising them on the proper equipment for certain etching applications and making sure that the equipment delivers accurate and consistent results.

Read the article titled “Tips on Improving Your Silicon Wafer Etching Process” for more details. Call 408-362-2000 if you have questions or would like to discuss how Modutek can help you improve your wafer etching processes.

How the Ozone Cleaning Process Improves Silicon Manufacturing Yields

Compared to the traditional cleaning process, the ozone cleaning process (using water or a mild acid) can clean or strip wafers faster and more cost-effectively. Modutek Corporation has developed its own Advanced Ozone Cleaning Process which doesn't necessitate the use of expensive cleaning solutions and eliminates waste while improving the cleaning process.

The ozone cleaning process works by providing cleaner silicon wafers with decreased particle amounts. For example, in Modutek's DryZone gradient dryer, the process cleanses substrates with DI water to eliminate inorganic impurities before exposing them to ozone in an ozone chamber. The result is a cleaner substrate surface -- free from impurities and moisture and become stable hydrophilic surfaces.

The wafers in Modutek's Organostrip process are exposed to an organic solvent incorporated with ozone at room temperature. This technology yields very high ozone solubility in the liquid. It results in faster resist removal. All types of tested metals (including aluminum, copper, gold, tantalum and titanium) are compatible in this process.

The ozone cleaning process has many advantages over the Piranha process. These advantages include more rapid processing, better compatibility with metals, fewer particles on the surfaces, improved safety, and lower operating costs.

Discover more about the Ozone Cleaning Process by reading the recent article titled “How the Ozone Cleaning Process Improves Silicon Manufacturing Yields” on Modutek’s website. For a free consultation or quote on using Modutek’s ozone cleaning process to improve your manufacturing yields, call 866-803-1533 or email modutek@modutek.com.

How Technology Manufacturers Use Chemical Delivery Systems

Safe handling and secure storage of chemicals, as well as their delivery in precise amounts, is the requirement of technology manufacturing. Corrosive chemicals (for etching, cleaning, plating, etc.) should be delivered to the process safely, in accurate amounts, and neutralized properly before disposal. Automated chemical delivery systems are able to handle these requirements with precision.

The key to supplying effective chemical delivery systems is an adaptable approach combined with the capability to develop systems that are tailor-made to meet the client's specific needs.

Modutek’s Chemical Delivery Systems feature fluid paths -- all made of Teflon -- double containment cabinet construction, leak detection and chemical level sensing. The software that commands the chemical delivery system can be highly customizable to meet the manufacturers' needs. These systems are flexible because of the customizable software which adapts to the manufacturer’s specific applications. For example, a company that manufactures silicon wafers may have different requirements compared to another company that makes solar cells or hard disk drives. For more details, read the full blog article “How Chemical Delivery Systems Are Used by Technology Manufacturers.” Contact Modutek Corporation at 866-803-1533 or send an email to sales@modutek.com.

Improvements to the Silicon Wet Etching Process

Continuous improvements to equipment design and materials has enabled the silicon wet etching process to produce improved wafer yields with less minimized defects on smaller sized geometries. To promote further improvements, Modutek strives to provide equipment designed to promote efficiency, safety, and low cost. 

·         Modutek's QFa Series High Temperature Recirculating Quartz Baths/Qa Series Constant Temperature Quartz Baths have been designed for etching, stripping, and heating.

·         Teflon Tanks - Standard and customized carrier sizes, different tank configurations, inline heating, and immersion heating are also available.

·         Silicon nitride etch baths - deliver exceptional process control while retaining flexibility in installation and operation.

·         Quick Dump Rinsers - can boost process efficiency by reducing rinse times and DI water consumption.

Modutek provides equipment and solutions that meet customer requirements. For more information on this topic read the blog article titled “Improvements to the silicon wet etching process”. For any questions on selecting the right manufacturing equipment for your requirements call Modutek at 866-803-1533.

Improved Process Control with Modutek's Silicon Nitride Wet Etching Bath

Modutek Corporation, known for manufacturing silicon wet etching equipment (including rotary wafer etching system and quartz baths) offers the Nb silicon nitride etch baths, upgrading their Na series.

Silicon nitride etching is done in a solution that contains 85% phosphoric acid and 15% deionized (DI) water. This acidic compound is set to a boiling point of 160 degrees C, leading to steaming and eventual water loss, which in turn results in increased boiling temperature. The Nb series features improved controls including:

•         A condenser which takes back some of the steam to the bath
•         A temperature controller that detects the rise of the boiling solution
•         A thermocouple that activates an interlock if there's no steam
•         Additional safety interlocks
•         An etched foil resistance heater

The Nb series' design allows for accurate nitride etching control, good etching consistency, boiling control, easy installation, and a high degree of safety. If you would like to learn more about any of Modutek’s silicon wet etching equipment, contact us at 866-803-1533 or by sending an email to sales@modutek.com to receive a free quote.

Use the KOH Etching Process with Modutek's Teflon Tanks

The potassium hydroxide (KOH) etching is an effective chemical process allowing for precise impressions within a silicon body. The process uses a solution of DI water along with heavy alkalinity (pH levels greater than 12). The solution's temperature is then adjusted to an ideal thermal degree required for etching. Unlike other forms of etching, this process allows for greater precision in terms of manufacturing silicon wafers.

Unlike dry etching, the KOH etching process reduces the risk of exposure to toxic (and even explosive) chemicals, creating a safe environment for manufacturing.

Modutek's Teflon Tanks are designed to facilitate the maximum potential of KOH etching. Each unit is manufactured to cater to the specific needs of clients. It can be used with wet bench equipment to greatly reduce the impurities other etching process may establish, providing more reliable, consistent results. For more details read the blog article titled “Using the KOH Etching Process with Modutek's Teflon Tanks.”

For more info about our Teflon Tanks, contact Modutek at 866-803-1533 or sales@modutek.com. 

Benefits of Using Quick Dump Rinsers for Silicon Wet Etching

Modutek's DR Series Quick Dump Rinser is designed for use during the rinse cycle in a silicon wet etching process. The use Deionized water (DI) during the rise cycle provides an essential step that is needed for particle and defect density reduction.

The DR Series Quick Dump Rinser provides a thorough and economical cleaning process. Its features and functionality allow for limited DI water use and ease of installation into new and existing stations. Our specialists can easily upgrade existing rinsing modules and install newly manufactured wet bench process stations to suit a client's needs.

The DR Series Quick Dump Rinser is compatible with the Modutek C15sa Rinser Controller, which is designed specifically for the rinse module. It also provides convenience to the cleaning process and is also highly adjustable.

The DR Series can also be used with Modutek's own Resistivity Motor RM30a for a more meticulous supervision of the cleaning process.

If you would like to learn more about Modutek’s DR Series Quick Dump Rinser, contact us at 866-803-1533 or email us at sales@modutek.com. 

Modutek’s Nitrite Etch Bath's Use in Silicon Wet Etching

Modutek Corporation has been providing semiconductor manufacturing equipment solutions for more than 30 years, creating and designing Silicon Wet Etching components and similar wet processing equipment and services. Modutek presents the "Nb" series which is part of their Silicon Nitrite Etch Bath products, a remarkable improvement to the previous "Na" series.

So what does Modutek's Silicon Nitride Etch Bath line of products do and what advantage does it give? They have been created, designed and engineered to give superlative process control.

The "Nb" series of Modutek's Silicon Nitride Etch Bath's distinct feature is its two-tiered diagnostic system. The advantages of the Nb series Silicon Nitride Etch Bath system are as follows:

• Its two-tiered diagnostic system, it lets the user control the temperature
• It controls the acid-to-water ratio through supplemented D.I. (de-ionized) water through its remote DI water metering system
• It retains consistency and uniformity in Silicon Nitride Wet Etching
• It allows control in boiling chemicals to avoid what is called "bumping"

Wet etching is a technique that removes certain materials through soaking the sample into an etch bath which has the liquid solution. The etchant is a kind of acid or corrosive chemical solution used for this purpose.

In this case, etches for silicon nitrides are a combination of 85% phosphoric acid, (H3PO4) and 15% D.I. water. The water boils typically at 160°C. Since the water boils, it will evaporate and carry the solution away as steam. To abate the steaming, the Nb series silicon nitride etch bath contains a refluxor will help carry the steam back into the water, thus condensing and maintaining its composition. Be aware, though, that these refluxors aren't 100% guaranteed to be effective, so it's still advisable to add the D.I. water to the solution from time to time.

Adding water to acid isn't usually advisable, except in this case. If the acid solution rapidly boils, it is required to add a small amount of water (a safe procedure). Otherwise, when you add water to the acid solution which doesn't boil, the resulting outcome is that the water will merely float on top of the acid. The top layer of the acid will be added with more water. As the water gradually takes in the heat, this is where it starts to boil. As long as the correct reaction takes place, the water will thoroughly blend with the acid solution.

The heater in the Silicon Etching System does not have to be controlled like other systems require. You have the option to regulate it though. If you leave the heater switch on, the heater will be on. By choosing not to regulate the heater, it will leave the solution still boiling no matter what the concentration is. While the solution is boiling, the water is added to the concentration. The water will remain sitting on top of the solution.

Some features of the Silicon Wet Etching and Nitrite Etch Bath systems include an etched-foil resistance heater, Teflon-fortified refluxor with safety cover, vapor thermocouple and uniformity heat transfer. These systems are also easy to install, as well as repair, in existing process stations or in new ones.

System specifications include the ideal operating temperature range (30-180ºC), required liquid solutions (water and phosphoric acid), a vapor thermocouple (a temperature-measuring device), PVDF refluxor with Teflon© cooling coils, process temperature control: ± 0.5° C, and chemical usage: H20, H3PO4. It also comes with a one-year warranty.

The Silicon Wet Etching system can be customized depending on the clients' needs. Companies may choose additional features for their system will be able to work with Modutek to ensure that it will meet the company’s needs and specifications. These options include gravity drain system reinforced with Teflon©, process controller and timer, and remote operator timer switches, pneumatically actuated auto cover, and RS232 interface.

Modutek Corporation can provide the system you need for Silicon Wet Etching. Our products can be redesigned for your current Nitride Etch Baths or other equipment you may have. Call us at 866-803-1533 to learn more.

Etching Applications Need Modutek’s Temperature Control Circulator for Reliability

Temperature Control Circulators are important for businesses using Buffered Oxide Etch (BOE) and HF applications. Modutek Corporation manufactures the RCe Series of sub-ambient temperature control circulators. The temperature can be controlled by amounts as low as 0.2°C. This is a result of the interface between our temperature control circulator and the silicon wet etching bath or other etch baths in your facility. The same would be true if you purchased a new etch bath or continue using the existing equipment. The design of the unit is compact (20.5” x 25.0” x 15.5”) and fits easily under your wet processing station or behind it.

The 134A Freon Compressor with our temperature control circulator replaces the R22 Freon compressor that is not compliant. This is an advantage that ensures your unit will meet current code requirements. The compressor size, fluid part options and heater size will enable you to choose the temperature control circulator that will match your system requirements.

Our electrical box, which includes on-board logic controls, also monitors process temperatures, heating and cooling. Not only are temperatures monitored, it also monitors reservoir levels and will let you know if flow levels drop off by sounding an audible alarm. Process temperatures often require constant temperatures or a specific temperature. There is alarm if the temperature fluctuates too much, also.

All Modutek temperature control circulators come with a standard 1500 watt stainless steel heater. If you need a different heater, 2500 and 3500 watt heaters may be purchased to upgrade the circulator if it is needed. The units are upgraded to Deionized (DI) water within the stainless steel fluid path. This is unique to the circulators manufactured by Modutek. Our RCe-01 series uses industry standard city water or reverse osmosis.

The standard temperature control circulator has a ¼ hp compress but can be upgraded to ½ hp, ¾ hp or 1 hp. Since our engineers work closely with your team of engineers, they will be able to design a system that will meet your requirements. If modifications are needed, our team is entirely in-house, which means you work exclusively with us and not an outsourced firm.

CE compliance is important for all Modutek equipment. The temperature control circulator is both CE compliant and environmentally friendly. The external status display allows you to see what is happening in the system. It has its own circuit breaker protection and maintenance on the unit is relatively easy should it be necessary.

The RCe Series temperature control circulator has specific housing requirements. The main power for the RCe025-1500 requires 120 VAC, 50/60HZ, 20A rating. The RCe Series requires 208VAC, 4-wire Circuit rating. In addition, it will need a ½” FNPT outlet/inlet in order for fluids to circulate properly.

If the processes you use on a daily basis require precise temperature controls, turn to Modutek Corporation. We have silicon wet etching process and can replace any chillers in your systems that are not compliant. Our temperature control circulator has been designed to exceed other chiller/heater units available today. Not only is it reliable, it is also safe. When you’re ready to replace the non-compliant chillers at your company, call Modutek Corporation. You may reach us at 866-803-1533 or through email Sales@Modutek.com. We welcome your questions and a chance to provide a quote.

Choose Modutek Quartz Baths for Reliability and Safety

The Quartz Bath systems manufactured by Modutek Corporation are both safe and reliable. Not only this, the Modutek Quartz Bath is also reasonably priced. This will make integration into your current production system cost-effective. We have over 30 years experience designing and manufacturing quality quartz bath systems, as well as developing and improving their designs.

Quartz has inert properties which make it non-reactive with other substances. For this reason, quartz is an excellent medium for use when manufacturing semiconductors. Quartz is also stable at high temperature which is another advantage. On the Mohs scale, it has a hardness level of 7. It lacks cleavage; this makes it safe for demanding processes.

Modutek manufactures a number of Quartz Bath systems. One is the QFa Series. This bath includes quick and even heating of the 4-sided heating element which is recessed. It was designed with serrated overflow barriers that can heat to 360°F. It has a seamless, sloped flange design and includes a switch with dual safety snaps. The design prevents runaway temperatures which can minimize damage potential. It also boasts a longer-than-average vessel life. This makes the QFa Series more reliable increases up-time. Finally, contamination from particulates is reduced which makes laminar flow easier.

The QFa Series Quartz Bath can be used with a variety of chemicals. These include, but are not limited to, H2SO4, H2O2 and SC1. The system can be operated between 30°C and 180°C. Depending upon the controller and processor, the temperature can be moderated +/- 1°C. The system heats up to operating temperature at 2°C per minute. This is based on the fluid being used, what size system and other factors. The system can be used for etching, cleaning and stripping. The fluid circulates through a ¾” male Flaretek inlet/outlet. You may choose these optional items: quartz diffuser plate, process temperature controller, autolid, liquid level sensor and vessel size that can be customized to your specific needs.

Modutek also manufactures the Qa Series Quartz Bath. It is similar to the QFa Series but has a 5-sided heating element. This improves heating time, efficiency and overall even heating. It can be purchased with a magnetic stirrer, process controller, remote timer, dilution aspirator valve system, gravity drain, and quartz bubbler.

To learn more about any of the Quartz Bath systems, or other Modutek Corporation products, call 866-803-1533. We are happy to discuss your specific Quartz Bath needs and how we might customize a system for your company.

Modutek Makes Quartz Baths That Are Both Reliable and Safe

Modutek Corporation has successfully created a safe, reliable Quartz Bath system. It is manufactured by Modutek and is reasonably priced, which will allow integration into current production systems in a cost-effective manner. Modutek is known as the quality standard for quartz baths after over 30 years of developing and improving the designs for these baths.

Because of the nearly inert properties of pure quartz, other substances will usually not react with it. This makes quartz an excellent selection to use in semiconductor processes. Besides being non-reactive, its stability even when heated is a great advantage. Its hardness level on the Mohs scale is 7 and it is safe for demanding processes due to its lack of cleavage.

One of the several Quartz Baths available from Modutek is the QFa Series. Some of the benefits of this bath include heating that is fast and even from a 4-sided heating element that is nested and has a serrated overflow barrier and which heats to 360 degrees Fahrenheit, a flange design that is seamless and sloped, and a dual safety snap switch. Its design prevents runaway temperatures, minimizing potential damage. A vessel life that is longer than the average results in better reliability and more up-time. Particulate contamination is reduced along with easier laminar flow.

Some of the chemicals that can be used with the QFa Quartz Bath include H2SO4, SC1, H2O2, and more. It can operate at temperatures between 30ºC - 180ºC. Control of the operating temperature, depending on the process and the controller, can be ±1ºC. The heat-up rate of the operating temperature is 2ºC per minute, depending on which fluid is used, the system’s size, and other factors. Uses include cleaning, etching, and stripping. Its circulating fluid inlet/outlet is a ¾” male Flaretek. Users can choose to add a quartz diffuser plate, autolid, process temperature controller, liquid level sensor, and custom vessel sizes to perfectly fit necessary specifications.

The Qa Series Quartz Bath has similar features to the QFa, with a 5-sided heating element rather than 4-sided, which improves speed, efficiency, and evenness of heating. Options include a magnetic stirrer, remote timer, process controller, gravity drain, aspirator (dilution) valve system, and quartz bubbler.

The size of the Quartz Bath of either series is customizable. Call for more information or a quote for the Modutek Corporation Quartz Bath that will best fit your needs at 866-803-1533.

Silicon Etching Equipment Options

Does your company use silicon etching equipment? If so, turn to Modutek. We have over 30 years experience manufacturing silicon wet etching products, along with semiconductor manufacturing equipment and ozone cleaning process equipment. You can turn with confidence to our in-house manufacturing team that will work with you to design the products you need for your applications.

Silicon wet etching, when used to make Micro-Electrical-Mechanical Systems (MEMS) components, will involve very tiny parts, often 0-100 microns in size. You will find the MEMS components in many products in a number of industries. Two of the most common industries using MEMs components are the medical and automotive industries. Some of the products that use them are MEMS accelerometers for car air bag sensors and Diabetic blood glucose meters.

Modutek offers different options for any company needing silicon etching equipment. The Sub-Ambient System (BOE), Quartz Baths, Nitride Etch Baths or Temperature Controlled Circulator are some of the equipment available. We work with you to understand your specific needs so we are able to build your silicon wet etching equipment to your specifications. We look forward to discussing your needs during our initial conversation.

• The QFa Series Quartz Bath, a recirculation quartz bath for high temperature liquids, has these options: quartz diffuser plate, liquid level sensor, auto lid, process temperature controller, and custom vessel sizes.
• The Qa series Quartz Bath has a 5-sided bonded circuit heating element, seamless flange design and redundant safety devices. You may also choose from the following: gravity drain, magnetic stirrer, remote operation timer switches, dilution valve system, quartz bubbler and process controller.
• The F Series Sub-Ambient Circulation Bath, for BOE applications, allows for continuous filtration to reduce acid consumption. It has high and low temp flow sensors, N2 blanket, 120VAC, 60Hz standard electrical service, pneumatic or electrical pump, and various sizes of micron filters available.
• The Nb Series Silicon Nitride Etch Bath was planned to supply the ultimate in process control. It is among the safest and most flexible silicon etching equipment. These are some of the options available for this equipment: pneumatically actuated auto cover, Teflon® gravity drain system, aspirator valve system, and remote operation timer switches. Learn more about the Theory of Operation document on our website.

When determining your requirements for silicon etching equipment, you will want to think about the following questions: What does the equipment need to accomplish? Will the silicon wet etching product produce what is needed? It is our goal to help you to decide if silicon etching equipment will meet your needs or if there is a different piece of equipment better suited to your application, as well as the options to help you meet your requirements.

If your company uses silicon etching equipment, and not every industry or business will, Modutek has the knowledgeable and experienced team you need. Our team will help to plan a silicon wet etching product that will best meet your company’s application and needs.