How the Ozone Cleaning Process Improves Silicon Manufacturing Yields

Compared to the traditional cleaning process, the ozone cleaning process (using water or a mild acid) can clean or strip wafers faster and more cost-effectively. Modutek Corporation has developed its own Advanced Ozone Cleaning Process which doesn't necessitate the use of expensive cleaning solutions and eliminates waste while improving the cleaning process.

The ozone cleaning process works by providing cleaner silicon wafers with decreased particle amounts. For example, in Modutek's DryZone gradient dryer, the process cleanses substrates with DI water to eliminate inorganic impurities before exposing them to ozone in an ozone chamber. The result is a cleaner substrate surface -- free from impurities and moisture and become stable hydrophilic surfaces.

The wafers in Modutek's Organostrip process are exposed to an organic solvent incorporated with ozone at room temperature. This technology yields very high ozone solubility in the liquid. It results in faster resist removal. All types of tested metals (including aluminum, copper, gold, tantalum and titanium) are compatible in this process.

The ozone cleaning process has many advantages over the Piranha process. These advantages include more rapid processing, better compatibility with metals, fewer particles on the surfaces, improved safety, and lower operating costs.

Discover more about the Ozone Cleaning Process by reading the recent article titled “How the Ozone Cleaning Process Improves Silicon Manufacturing Yields” on Modutek’s website. For a free consultation or quote on using Modutek’s ozone cleaning process to improve your manufacturing yields, call 866-803-1533 or email modutek@modutek.com.