How Robotics Have Revolutionized Semiconductor Manufacturing

The use of robotic automation in wet bench stations over the last 25 years has dramatically improved production efficiencies and output quality.  The manual handling and mixing of chemicals, silicon wafers and following process steps can be tedious and error prone and mistakes could result in defective products. Semiconductor equipment manufacturers have developed automated process controls that have significantly improved wafer yields and reduced the use of chemicals.

Modutek has been at the forefront in developing robotics and process control software to provide fully automatic or semi-automatic processing of silicon wafers. Their focus in developing automation and control systems that meet all customer requirements has resulted in improved yields, less waste, and less operator mistakes.

Through the use of robotics and process control software the entire semiconductor equipment manufacturing process is controlled accurately and reliably. Advances in robotics have enabled Modutek and other semiconductor equipment manufacturers to offer fully automated and semi-automated stations. These wet benches and chemical stations can control the entire semiconductor manufacturing process with limited or no operator intervention.

Both semi-automated and fully automated wafer fabrication equipment provides excellent process uniformity. The main difference is the lower cost of semi-automated stations may be ideal if full automation is not required. A key advantage Modutek offers over other semiconductor equipment manufacturers is that all robotics and control software is designed, assembled and tested in-house. This ensures that their equipment will meet the specific requirements of each customer and provide the following advantages which include:

• Reduced costs and improved output quality
• Elimination of human error
• Accurate and precise chemical use
• Less waste
• Increased reliability
• Improved safety
• Reduced contamination

Although some semiconductor manufacturing applications can be automated with standard solutions, in many cases the specific needs of a customer often require a degree of customization with both the process control software and the robotics. With Modutek’s experience and in house expertise in developing robotics and custom software controls, developing custom applications for customers is never a problem. The development team at Modutek knows how each part of the automated system works and can make any necessary changes based on a customer’s requirements.  

For more details read the complete article, “How Robotics Have Revolutionized Semiconductor Manufacturing”, on how Robotics has make the wafer fabrication process more efficient, predictable and safer. Contact Modutek for a free consultation or quote at 866-803-1533 or email Modutek@modutek.com.

How Megasonic Cleaners Improve Silicon Wafer Manufacturing

One of the key process steps in semiconductor manufacturing is the cleaning of silicon wafers. This has become even more crucial as micro geometrics continues to shrink on 300 mm silicon wafers. Sub-micron particles must be removed without damaging the wafer surface from the previous steps. Particles that remain on the wafer substrate may result in defective semiconductor components or low-quality devices with sub-par performance.

That's where megasonic cleaning comes into the wafer cleaning process. It helps in removing sub-micron particles and contaminants without damaging or altering the wafer surface.

Megasonic cleaning systems use a high-frequency generator to create high-frequency sound waves using a transducer that is submerged in the cleaning liquid inside a tank. The sound generates compression waves that create high pressure at their peaks and low pressure at their troughs. Small cavitation bubbles are generated from the troughs and collapse in high-pressure peaks. The collapse of the bubbles creates a high-energy scrubbing action that effectively dislodges particles and contaminants from the surfaces being cleaned.

The right frequency and power selection are crucial factors to achieve effective and thorough cleaning. Lower ultrasonic frequencies in the 20-100 kHz range generate larger bubbles that are ideal for more robust cleaning. For semiconductor cleaning megasonic cleaning the megahertz frequency range is required since it generates smaller cavitation bubbles that produce a thorough but gentler cleaning, without damaging the wafer surface.

The use of megasonic cleaning in silicon wafer manufacturing improves the overall effectiveness of the chemical cleaning solution. The powerful scrubbing action of the energetic cavitation bubbles helps in removing sub-micron contaminants and particles from the wafer surface.


Read the complete article titled “How Megasonic Cleaners Improve Silicon Wafer Manufacturing,” for more details about how Modutek incorporates the use of Megasonic cleaners in wet bench equipment. For a free consultation or quote call Modutek at 866-803-1533 or send an email to Modutek@modutek.com.