What Fume Scrubbers Do and the Benefits They Provide

Manufacturing processes that include semiconductor etching or parts cleaning with strong chemical solutions create exhaust fumes containing process chemicals in gas or droplet form. Such fumes are dangerous to the human health and are also corrosive to machinery.

Environmental regulations also require that exhaust fumes created must be neutralized before they can be released into the atmosphere. Modutek's Fume Scrubbers use a wet packed bed to remove acid and base chemical traces in chemical process exhaust fumes. The exhaust fumes pass through a wet packing material. The chemicals are removed when they come in contact with the neutralizing solution from the beds, therefore dissolving the harmful gases. These gases are then effectively neutralized and are no longer present into the air. Manufacturers know their employees are safe because there are no hazardous chemical fumes.

Modutek manufactures Scrubbers that come in custom sizes and in a wide range of air handling capacities from 500 CFM to 25,000 CFM. Each unit is designed to meet the air quality standards of the customer. Modutek’s Fume Scrubbers are highly efficient and designed for low-cost of operation and low water usage. Automatic pH control of the scrubber water provides optimized operation and allows removal of acid and base chemical fumes of up to 99 percent. The scrubbers utilize material from packing media industry leader Lantec which optimizes the surface area of the scrubber solution exposed to the fume gases and keeps water usage to a minimum.

To learn more about Modutek’s Fume Scrubbers, and their benefits, read the complete article titled “What Fume Scrubbers Do and the Benefits They Provide”. 

Silicon Wafer Cleaning: Effectively Removing Contaminants to Improve Yields

The key to successful semiconductor manufacturing is the effective cleaning of silicon wafers during various stages in the manufacturing process. The equipment and processes used in silicon wafer cleaning needs to effectively remove impurities, contaminants, and residues to ensure that the manufactured components meet the required functionality and quality. Modutek’s silicon wafer cleaning equipment helps to optimize yields and uses the most advanced cleaning processes to produce high-quality results.

RCA Cleaning - Consists of immersion of the silicon wafers in hot acidic acid and alkaline cleaning solutions.

Megasonic Cleaning - Complements RCA Cleaning with the use of megasonic cleaning technology that produces cavitation bubbles to remove microscopic particles that create component defects.

SPM Clean-Piranha Etch – This is used in cleaning heavily contaminated and clearly visible contaminants in silicon wafers. Hydrogen peroxide and sulphuric acid are the cleaning solutions.

FFEOL and BEOL processing - Front End of Line (FFEOL) processing is a part of semiconductor manufacturing where the components are created in a semiconductor wafer. The Back End of Line (BEOL) involves depositing the metallic interconnections.

Modutek specializes in silicon wafer cleaning equipment for the semiconductor manufacturing industry and provides a complete line of semiconductor cleaning solutions. In addition to chemical cleaning stations Modutek incorporates the use of Megasonic cleaning equipment and IPA vapor dryers. You may learn more about “Silicon Wafer Cleaning: Effectively Removing Contaminants to Improve Yields” by reading the blog article on the site.