Changes to the SPM Process Improves Efficiency and Results

The sulfuric acid peroxide measure (SPM) is the process that effectively strips and cleans silicon wafers, however due to the decomposition of the hydrogen peroxide it suffers from instability. Heated baths can speed up the process, but they can affect the concentration of the hydrogen peroxide. Periodically adding the mixture with extra hydrogen peroxide, on the other hand, will maintain its concentration but it can affect the strip rate. As a result, the SPM mixture needs to be changed as frequently, and leads to high costs of chemicals and frequent downtime on wet bench stations.

Modutek has addressed the SPM issues with its new “bleed and feed” spiking system, which uses a double clean-and-dirty tank process. This newSPM strip and clean process starts by draining a programmable amount of mixture prior to each process step. Next, a programmable amount of sulfuric acid is added to a clean tank. Now both tanks have the programmable amount of hydrogen peroxide.

With the “bleed and feed” method, a complete chemical change is now only required about once a week as compared to two or three times a day. It also helps in reducing downtime and enables the process to get up again quickly. Result is less frequent changes and use of costly chemicals.

The “bleed and feed” system is also PLC-controlled, and the periodic adding/spiking of chemicals enables the mixture to be used continuously for longer periods of time. In addition this updated process is more efficient in delivering better cleaning and stripping performance.

For additional details about the SPM process upgrade on Modutek’s wet bench stations, read the complete article entitled “Changes to the SPM Process Improves Efficiency and Results.” If you need more information or have questions, please send an email to modutek@modutek.com or call Modutek at 866-803-1533.

Modutek At 2018 Semicon Conference in China

Modutek Corporation, a leading provider of wet bench stations and wet process equipment, will be at the Semicon Conference in Shanghai China from March 14-16, 2018 with their factory representative Laserwort Ltd.  They will be located in Hall N2 at booth 2431. Information about the Semicon Conference can be referenced at http://www.semiconchina.org/ and details on Modutek’s attendance at the conference can be referenced at: Modutek at Semicon Conference in China

Come by the Modutek /Laserwort booth to get information and answer any questions you have about using Wet Bench Process Stations for acid/base, solvent and ozone cleaning or photo resist strip.  In addition Modutek will also provide information about the benefits of their new IPA vapor dryer with the HF last process. Modutek serves customers around the world who require any type of wet processing equipment and builds chemical delivery systems for pharmaceutical, biochemical, solar and semiconductor manufacturing.

Additional details on some of Modutek’s products are listed below:

Single Chamber HF Last IPA Vapor Dryer

Benefits include:

·         Most drying cycles completed within 10 to 15 minutes

·         Very low consumption of IPA

·         No moving parts inside drying chamber eliminating wafer breakage

·         Eliminates watermarks

·         Drying technology can be designed into wet bench eliminating one transfer step

Features include:

·         Single drying chamber for DI water rinsing and IPA vapor drying

·         On board HF metering for precision mix ratios

·         Uses an in situ HF etch process with a rinse step before the IPA drying cycle

·         Filter bypass for contamination control with no cassette contact points

·         Easy to change IPA bottles

·         Handles all process sizes (standard wafer carriers to glass substrates)

Fully-automated Wet Bench Equipment

Benefits include:

·         In house customization to meet customer process requirements

·         Precise automated process execution and reliable repeatability

·         Full automation control with touch screen

·         Improved yield and reduced errors

·         SolidWorks Simulation software for accurate calculation of process parameters

·         All robotics and software design designed in house

·         Complete design, assembly and test at one location to meet your specifications

Semi-automated Wet Bench Equipment:

Benefits Include:

·         Automation control with touch screen

·         Servo motor automation

·         SolidWorks Flow Simulation software

·         SolidWorks Simulation Professional software

·         All robotics and software designed and developed in house

·         Complete design, assembly and test at one location to meet your specifications

Manual Wet Bench Equipment:

Benefits Include:

·         High end manual equipment at competitive pricing

·         Meets or exceeds all current safety standards

·         Low cost of ownership

·         Designed to meet any process requirements

·         Can accommodate custom designs and processes

·         Equipment designed for future expansion

All wet bench equipment supports the following applications:

• KOH Etching
• Quartz cleaning
• Ozone Strip
• Ozone Cleaning
• SC1 & SC2 (RCA Clean)
• Megasonic Cleaning
• BOE (Buffered Oxide Etching)
• MEMs processing
• All solvent applications
• Hot phosphoric (Nitride Etching)
• SPM Cleaning
• Precision Part Cleaning

Modutek has over 37 years of industry experience and expertise in developing and building wet bench stations and wet process equipment that provides highly reliable results for precision processes. They also provide world-class service, and customer support. Contact Modutek at 866-803-1533 or email Modutek@Modutek.com for a free quote or consultation to discuss your requirements.