How the IPA Vapor Dryer Improves Wafer Processing Results

Silicon wafers require cleaning, rinsing, and drying at certain stages of the fabrication process. The results need to be as flawless as possible, leaving no watermarks and only minimal particle contamination. However incorrect cleaning and drying may lead to contamination, which can cause serious product malfunction and high failure rates. That’s why many semiconductor manufacturers and research facilities use an IPA Vapor Dryer.

Simple methods like rapid spinning and heat drying will no longer work with the latest high-density wafers. Since water is hard to remove from these complex shapes, drying without leaving watermarks is essentially impossible.

This is why cleaning with isopropyl alcohol (IPA) is necessary. IPA drying using the vapor method delivers wafers that are completely free of watermarks and with minimal contamination. Modutek’s IPA vapor dryer features a design which obtains high-quality results by serving IPA vapor at the upper reaches of the drying tank, which ensures the distribution is even. Since the IPA's surface tension is lower than that of water, such vapor serving introduces a gradient of surface tension where IPA meets with a layer of water on the water surface.

Using the “Marangoni drying effect” water quickly leaves the surface and leaves the surface completely dried and clean. Since water never actually evaporates, it leaves no watermarks behind. Ozone is applied into the drying tank to make sure that the drying process does not leave any trace of contamination. The process takes no longer than 15 minutes.

Modutek's in-house team of experts in IPA vapor dryer design will work with a client’s technical team to design and create IPA Vapor Dryers that will specifically meet their application requirements. Clients can also come to Modutek’s facility to review testing results and confirm the equipment will work as needed.

Read the complete article “How the IPA Vapor Dryer Improves Wafer Processing Results” to learn more about Modutek’s IPA vapor dryers. For a free consultation or quote contact Modutek at modutek@modutek.com or call 866-803-1533.

How to Qualify Which Semiconductor Equipment Manufacturers Meet Your Requirements

There are lots of things to consider when you review potential suppliers to use from a list of semiconductor equipment manufacturers. Below are some of the things to consider.

Can the semiconductor equipment manufacturer supply the equipment you need when customized solutions are needed to meet your specific requirements? Whether a customer needs to upgrade equipment, replace old equipment with newer ones or have new components integrated with existing systems, manufacturers need to provide extensive experience and expertise with such customizations. In that way, they will be able to supply the exact equipment that will suit a customer's specifications and requirements.

After Equipment is purchased and set up at a facility it needs to be reliable and stay online for long periods of time and with minimal downtime. The best way to find out if a supplier can provide equipment of such description is to contact references and review their reliability statistics.

Once a customer has chosen a specific supplier, they should review the warranty and support capability first before signing a contract. New equipment warranties usually come with at least one year. As for after-sales support, the customer should also check on the strength of the supplier's service department. The most generous warranties will not be of much use if the supplier has few personnel that are able to deliver on it.

Customers should also avoid suppliers that use third-party service support because it is a strong indication that these suppliers are not well equipped to provide quality after-sales support. The best way to check on a company's service ability is to simply call with a question prior to purchase. In most cases, it’s also best to use a supplier that has a proven track record in providing equipment and service to industry manufacturers. Modutek is a leading semiconductor equipment manufacturer with over 35 years of experience that you can trust to meet your specific needs.

For more details read the complete article titled, “How to Qualify Which Semiconductor Equipment Manufacturers Meet Your Requirements”. For a free quote or consultation contact Modutek at Modutek@modutek.com or call 866-803-1533.

How New Equipment Has Improved the Silicon Nitride Wet Etching Process

The silicon nitride wet etching process uses phosphoric acid to remove silicon nitride masks from silicon wafers to allow clean wafers to undergo the next fabrication steps. This process is difficult to control because the hot phosphoric acid and water mixture is unstable and that requires the periodic addition of small quantities of water in order to achieve optimum etching performance. However, adding water to phosphoric acid may result in a reactive bump. Modutek has developed a new approach that controls the nitride etching process more accurately and safely while at the same time achieving high etching rates.

Since Silicon nitride is a key component to semiconductor wafer manufacturing, Modutek has developed the new Nb series Silicon Nitride Wet Etching Bath. It provides a tighter control of the bath temperature while guaranteeing safe operations and superior etching of the silicon nitride masks.

Modutek’s silicon nitride wet etching process uses the acid mixture concentration as a reference value for adding small amounts of DI water. The boiling point of the mixture depends on the concentration, but in a normal operation, the typical mixture point is 160 degrees centigrade. When water is lost, the mixture concentration starts to rise above 160 degrees centigrade. DI water is added into the boiling acid, and the concentration of the acid is reduced bringing the temperature back to 160 degrees centigrade.

Modutek's Silicon Nitride Wet Etching Bath has the thermocouple sensor which detects the presence of steam. It closes the water valve when there's no longer steam to prevent the further addition of water to the boiling acid. This additional safety feature is designed to prevent dangerous situations as a result of mixing large amounts of water and the hot phosphoric acid.

For more details about Modutek’s silicon nitride wet etching baths and the results customers have achieved in using them read the complete article “How New Equipment Has Improved the Silicon Nitride Wet Etching Process”. If you would like to learn how Modutek’s silicon nitride wet etching bath can be used for your application, call Modutek at 866-803-1533 or email Modutek@Modutek.com.

How to Safely Use Solvents for Wafer Processing

Solvent wet bench equipment is designed for operations which include substrate cleaning, photoresist stripping, and liftoff pattern transfers. The wet bench stations provide a critical role in the semiconductor fabrication process. Since solvents are often highly inflammable, wet bench equipment needs to be designed to follow stringent safety codes.

Precautions related to fire and electrical safety is some of the most basic requirements in the design of wet bench stations. There are also requirements for safety alarms, carboy collections, heated solvent baths and process timers. Only well trained and authorized individuals should access the wet bench equipment. In many cases, added safety measures from simple approaches, such as using auto-lids made of Teflon or stainless steel used for sealing off chemical containers.

Solvent applications require the use of stainless steel. Modutek's solvent stations are constructed of 304 stainless steel, which makes them suitable for photoresist, IPA and acetone which are critical operations in the wafer processing. Plus, Modutek's solid works and professional flow simulation software provide improvements in productivity.

Modutek's safety design for solvent processing involves every required feature:

• Wiring specified to meet NFPA 70 & 70 codes;
• Emergency power off design for every safety interlock;
• Lip exhausts on all solvent tanks;
• N2 head case purge design;
• Photohelic EPO interlocks;
• Safety shields;
• Teflon N2 guns;
• Continuous flow of the water manifolds;

Modutek's stainless steel solvent stations are available in manual, dry-to-dry, semi-and-fully automated designs. Wet bench design and construction is a complicated process, but Modutek ensures their systems that are designed to meet all industry safety requirements as well as the specific requirements of individual customers.  

Our full article “How to Safely Use Solvents for Wafer Processing” explains more about this topic. Call Modutek at 866-803-1533 if you have questions or would like to get a free consultation or quote.

Improving Wafer Processing with Automated Equipment

Fully and semi-automated wafer processing equipment can help improve wafer output quality by providing consistent chemical processing dosages and timing. However process settings must first be determined manually, then in semi-automated mode where the settings can easily be adjusted or fine tuned.

This especially applies to new process development where the exact parameters are yet to be determined. Wafer fabrication facilities may try out the initial settings first in manual mode and make some appropriate adjustments. Then they may automate some of the processes using semi-automated stations for parts of the process that are finalized while making additional manual adjustments for optimize results. The final processing parameters can then be implemented in a fully automated station.

After the initial run, the problem areas can be identified, and variables such as chemical dosages and timing can be revised and adjusted. Skilled and experienced operators can do the fabrication steps and make changes easily on the manual station. In manual mode operators has complete control of the process. This control is important for determining the initial settings of a new process.

When the changes have been finally made on the major parts of the new process, there may still have some necessary minor adjustments necessary to achieve targets such as faster processing, better quality output or reduced usage of chemicals. For this reason, the semi-automated stations can be used to save time.

Once the parameters and variables for the desired yield and performance have been determined, a tailor-made software and automation package can be assembled. These packages are implemented in fully automated wafer processing equipment which can reproduce the custom settings of the manual and semi-automated process steps and use them to produce the desired results consistently.

Modutek can work closely with a customer to determine the best way to optimize a new process. For more details read the complete article, “Improving Wafer Processing with Automated Equipment.”If you have questions or would like a free consultation to discuss your specific needs call 866-803-1533 or email Modutek@modutek.com. 

How Acid Fume Scrubbers Work to Maintain a Clean Work Environment

Creating silicon wafer microstructures, integrated circuits, and processors require an extensive multi-step process that consists of etching, stripping and cleaning silicon wafers.

Chemicals like sulfuric acid, hydrochloric acid, and hydrogen peroxide can carry out these operations effectively but they give off vapor and fumes that can be harmful to workers inside and outside the workspace. There are also regulatory compliances issues for a safe working environment and for emissions to the outside environment. Acidic vapors coming from the wet process stations consist of tiny droplets, which can be extremely corrosive and can negatively impact the health of workers when inhaled. This requires the use of acid fume scrubbers which remove harmful vapors from the air to leave a clean workspace and clean air that can be discharged outside the manufacturing facility. Modutek provides acid fume scrubbers that have a high level of efficiency and low cost of operation as well.

How do Modutek’s acid fume scrubbers work to keep the work environment free of these harmful vapors? They neutralize the acid vapors and clean the exhaust air so that it is no longer dangerous for workers or harmful for the environment. The exhaust air containing the acid vapors is first passed over a bed of wet packing material, which has a special liquid that includes a chemical that safely neutralizes the acid. The acidic mist passes over the wet packing bed, where the acid is neutralized and absorbed from the exhaust air. The air that goes out of the scrubbers contains only faint traces of acid that is safe to discharge in the air.

The effectiveness of the scrubbers depends on the volume of air the scrubbers must “clean” as well as the surface area of the wet packing. Modutek’s high-efficiency acid fume scrubbers can help keep your work environment clean and healthy.

Read the complete article titled “How Acid Fume Scrubbers Work to Maintain a Clean Work Environment” for more details on how the acid fume scrubbers work.  If you would like to learn more about Modutek’s acid fume scrubbers, call for free consultation or quote at 866-603-1533 or send an email to Modutek@modutek.com.

How Customized Equipment Has Improved the Silicon Wafer Cleaning Process

Specific customer requirements or unusual process characteristics may require the use of customized systems or components. In order to support these kinds of projects, suppliers must have extensive in-house expertise as well as a broad range the silicon wafer cleaning equipment to offer custom solutions.

Modutek has extensive in-house expertise and provides a full line of silicon wafer cleaning equipment to meet customer needs. This can improve throughput, lower costs, and result in higher output quality and yield.

Modutek's SolidWorks Simulation Professional and SolidWorks Flow Simulation software allow customers to calculate precise chemical doses as well as monitor on chemical usage. Modutek writes and develops their own software so that the company can make the necessary adjustments and implement software customization whenever the client requires it.

This means that the client can use software that is modified to their own customized systems rather than trying to operate a custom system with standard software. The great thing about Modutek's software is that it can be tailored to make accurate control and monitoring even for the most customized installations.

There are several types of custom-fit equipment that is incorporated within a wafer cleaning installation. These can include the following:

·         Megasonic Systems

·         Quartz Baths

·         Teflon tanks

·         Other custom equipment

Modutek can also provide customized versions of these components to fit any new or existing wet process system to optimize the silicon wafer cleaning process.

Modutek also develops custom wet bench designs based on the certain process specifications – the software, the chemical delivery system, baths a, d wafer handling. They need to all fit together to satisfy the process requirements.

The silicon wafer cleaning processes can be also customized at the component or system level, but they can also feature customized levels of automation. There is the standard manual, semi-automatic and fully automatic systems but there is also a possibility of “special” systems, e.g., customers may want a manual system but at the same time, they also want certain process sub-steps to be run automatically.

If you need customized silicon wafer processing equipment, read the complete article titled “How Customized Equipment Is Improved with Specialized Equipment” then call Modutek at 866-803-1533 or email Modutek@modutek.com to discuss your specific needs.

How Silicon Wet Etching Processes Are Improved with Specialized Equipment

Modutek's standard line of silicon wet etching equipment already scores on factors such as cleanliness, repeatability, tight control and precise dosages. These factors will result in high output quality, fast processing, high yields, and reliable outcomes.

However, Modutek also offers specialized equipment that can further improve performance for certain processes:

1) Buffer Oxide Etch (BOE)
This process requires tight and precise temperature control while filtering lowers the particulate count and reduced acid consumption results in lower costs. Modutek uses the F-series sub-ambient circulation bath that is specifically designed for this process.

2) Piranha Etching
The Piranha etching process involves a mixture of sulfuric acid/hydrogen peroxide, which is highly corrosive. The mixture is also exothermic (accompanied by heat) when prepared. Modutek's QFa series of Quartz High Temperature Recirculating Baths is specially designed to withstand high temperatures.

3) Potassium Hydroxide (KOH) etching
Modutek Teflon tanks are ideal for KOH etching process because they can be custom fitted to any wet bench configuration. They come in three models to satisfy common heating and recirculating requirements:

Tfa series – temperature-controlled and overflow recirculating models
TI series – temperature-controlled and static models
TT series – static ambient temperature models

All Teflon tanks are made from PFA Teflon with special welding techniques to minimize the presence of undesirable by-products in the process and to reduce contamination.

4) Silicon Nitride Etching
The mixture used in this etching process consists of silicon nitride with a phosphoric acid deionized water. This is challenging because the concentration of the mixture changes as DI water evaporates and adding water to it can cause an explosion. Modutek's silicon nitride wet etching bath is specifically designed to address these issues and provides a reliable and safe process control.

Read our recent article entitled “How Silicon Wet Etching Processes Are Improved with Specialized Equipment” to learn more about the equipment designed to support each of these etching processes. You can also call Modutek at 866-803-1533 or send an email to Modutek@modutek.com if you would like to set up a free consultation to discuss your specific needs.

New SPM Process Provides 75% Improvement in Chemical Savings

Modutek has recently implemented the new SPM process and the company now has benchmark results from real process applications which show a significant improvement in chemical savings. The new SPM process requires the use of Modutek’s custom designed SPM process wet bench. Modutek designs and assembles wet benches and semiconductor manufacturing equipment at their facility in San Jose, California and provides systems that exactly meet their customers’ requirements.

Usually, the SPM mixture deteriorates as hydrogen peroxide turns to water and dilutes the concentration. The SPM mixture must be completely replaced at least every eight hours. This results in downtime during new mixture pour, replacement of the chemicals as well as neutralizing and disposal of the corrosive mixture in an environmentally safe way – and all these costs a lot. The SPM clean process is proven to provide results.

Modutek's “Bleed and Feed” system is designed to maintain the SPM mixture concentration automatically over extended periods. In this system, there is a “clean” tank and a “dirty” tank. A programmable amount of mixture goes out of the dirty tank, and another programmable mixture is automatically transferred from the clean tank to the dirty tank. To make up for that, an appropriate amount of sulfuric acid is added, and both tanks have hydrogen peroxide to restore and maintain the concentration.

One of Modutek’s customers that have used their semiconductor manufacturing equipment now has real life results from using the “Bleed and Feed” SPM process improvements. The results show remarkable improvements that include the reduction in volume of the following: sulfuric acid use, acid neutralizer use and chemical disposal volume. Costs in acid re-agent use are also significantly reduced. System drains are now cut down from three times a day to once a week. Downtime is not needed to drain and re-pour the mixture, and throughput is also increased. Safety is now improved due to reduced operater interaction with dangerous chemicals.

You can learn more about the new SPM Process by reading the complete article titled “New SPM Process Provides 75% Improvement in Chemical Savings.” Modutek is available to answer questions or provide a free consultation. You may reach them by calling 866-803-1533 or email modutek@modutek.com. 

How Chemical Delivery Systems Are Designed to Meet Customer Requirements

Many industry activities require the supply of various chemicals for their manufacturing and production processes. Chemical delivery systems often must be customized to exactly meet the requirements of a facility, since certain industrial processes may include special procedures and the use of specific chemicals.

Typical custom requirements deal with the following:

Delivery volumes

The quantities of chemicals used will significantly impact the design of a chemical delivery system. There are bigger bulk containers that handle large volumes of chemicals as well as drums or tanks that carry smaller volumes (but they have to be changed sometimes when the process requires a different chemical or when a new production process starts). In each caseload or level sensing must be available so that production personnel can plan the required delivery. The use of software allows operators to predict flow requirements so adequate chemical supplies can be kept on hand.

Precision and Repeatability

Different industrial processes, such as semiconductor manufacturing processes may have their own specific requirements for precision. Precision is often connected with repeatability – if a process must run in the same manner each time, the precision for chemical delivery must be the same for each run. Custom designs can ensure that precision and reliability are achieved, especially when high precision is required.

Safe Handling and Disposal

Since each chemical presents its own hazards and dangers, safe handling and disposal are of another importance. Customized chemical delivery systems provide an additional level of safety to employees handling chemicals and operating the delivery systems for specialized applications. Custom designs can incorporate the use of double-walled containment, corrosion-resistant fluid paths, and leak detection. Neutralization and disposal also require a customized approach because of the different ways chemicals are used and due to different disposal requirements.

Custom Chemical Delivery Systems from Modutek

Modutek can customize chemical delivery systems to meet the specific requirements of their customers. They design and build their systems in-house and can also customize the chemical delivery software according to the requirements of each manufacturing or production facility.


Read the complete article “How Chemical Delivery Systems Are Designed to Meet Customer Requirements” to learn more about Modutek’s chemical delivery systems. If you have questions or would like to discuss your specific needs, call 866-803-1533 or email Modutek@modutek.com.

How Robotics Have Revolutionized Semiconductor Manufacturing

The use of robotic automation in wet bench stations over the last 25 years has dramatically improved production efficiencies and output quality.  The manual handling and mixing of chemicals, silicon wafers and following process steps can be tedious and error prone and mistakes could result in defective products. Semiconductor equipment manufacturers have developed automated process controls that have significantly improved wafer yields and reduced the use of chemicals.

Modutek has been at the forefront in developing robotics and process control software to provide fully automatic or semi-automatic processing of silicon wafers. Their focus in developing automation and control systems that meet all customer requirements has resulted in improved yields, less waste, and less operator mistakes.

Through the use of robotics and process control software the entire semiconductor equipment manufacturing process is controlled accurately and reliably. Advances in robotics have enabled Modutek and other semiconductor equipment manufacturers to offer fully automated and semi-automated stations. These wet benches and chemical stations can control the entire semiconductor manufacturing process with limited or no operator intervention.

Both semi-automated and fully automated wafer fabrication equipment provides excellent process uniformity. The main difference is the lower cost of semi-automated stations may be ideal if full automation is not required. A key advantage Modutek offers over other semiconductor equipment manufacturers is that all robotics and control software is designed, assembled and tested in-house. This ensures that their equipment will meet the specific requirements of each customer and provide the following advantages which include:

• Reduced costs and improved output quality
• Elimination of human error
• Accurate and precise chemical use
• Less waste
• Increased reliability
• Improved safety
• Reduced contamination

Although some semiconductor manufacturing applications can be automated with standard solutions, in many cases the specific needs of a customer often require a degree of customization with both the process control software and the robotics. With Modutek’s experience and in house expertise in developing robotics and custom software controls, developing custom applications for customers is never a problem. The development team at Modutek knows how each part of the automated system works and can make any necessary changes based on a customer’s requirements.  

For more details read the complete article, “How Robotics Have Revolutionized Semiconductor Manufacturing”, on how Robotics has make the wafer fabrication process more efficient, predictable and safer. Contact Modutek for a free consultation or quote at 866-803-1533 or email Modutek@modutek.com.

How Megasonic Cleaners Improve Silicon Wafer Manufacturing

One of the key process steps in semiconductor manufacturing is the cleaning of silicon wafers. This has become even more crucial as micro geometrics continues to shrink on 300 mm silicon wafers. Sub-micron particles must be removed without damaging the wafer surface from the previous steps. Particles that remain on the wafer substrate may result in defective semiconductor components or low-quality devices with sub-par performance.

That's where megasonic cleaning comes into the wafer cleaning process. It helps in removing sub-micron particles and contaminants without damaging or altering the wafer surface.

Megasonic cleaning systems use a high-frequency generator to create high-frequency sound waves using a transducer that is submerged in the cleaning liquid inside a tank. The sound generates compression waves that create high pressure at their peaks and low pressure at their troughs. Small cavitation bubbles are generated from the troughs and collapse in high-pressure peaks. The collapse of the bubbles creates a high-energy scrubbing action that effectively dislodges particles and contaminants from the surfaces being cleaned.

The right frequency and power selection are crucial factors to achieve effective and thorough cleaning. Lower ultrasonic frequencies in the 20-100 kHz range generate larger bubbles that are ideal for more robust cleaning. For semiconductor cleaning megasonic cleaning the megahertz frequency range is required since it generates smaller cavitation bubbles that produce a thorough but gentler cleaning, without damaging the wafer surface.

The use of megasonic cleaning in silicon wafer manufacturing improves the overall effectiveness of the chemical cleaning solution. The powerful scrubbing action of the energetic cavitation bubbles helps in removing sub-micron contaminants and particles from the wafer surface.


Read the complete article titled “How Megasonic Cleaners Improve Silicon Wafer Manufacturing,” for more details about how Modutek incorporates the use of Megasonic cleaners in wet bench equipment. For a free consultation or quote call Modutek at 866-803-1533 or send an email to Modutek@modutek.com.

Why Teflon Tanks Are Used with the KOH Etching Process

KOH etching is more preferred compared to many other silicon wafer fabrication methods because it works rapidly and reliably, while handling of the chemicals is relatively safe. The KOH etching process controls the etching speed by relying on a contamination-free environment and using the temperature and KOH concentration.

Only Teflon tanks are used in this process because Teflon is stable and doesn't deteriorate or corrode from using KOH etching.

The KOH etching process controls allow precise and repeatable temperature controls for positive fabrication results and high-quality production. KOH etching in Teflon tanks, along with temperature control, is an exceptional process for silicon wafer nanostructure fabrication in both manufacturing facilities and research environments.

KOH or potassium hydroxide etches silicon quickly and at a stable rate which relies on the concentration of the solution and the temperature of the liquid. Aside from that, this etching process is also influenced by the crystal planes of the silicon and the doping concentration. These factors can be applied for direct etching in certain directions and stop etching at defined points. The result is that KOH etching can produce the accurate nanostructures required if the crystal planes and the doping are used accurately.

Modutek, a company with over 30 years of experience providing semiconductor equipment solutions, offers Teflon tanks that are specifically designed to support the KOH etching process, which ensures high-quality wafer fabrication.

Teflon tanks are used because aside from its stability, they have the ability to eliminate contamination from the tanks or fluid paths by making sure that the KOH solution only comes in contact with Teflon. Teflon is not affected by the corrosive chemical. In addition Modutek’s Teflon tanks are welded using advanced PFA sheet welding techniques, which guarantees reduction of contaminants.

The complete article “Why Teflon Tanks Are Used with the KOH Etching Process” explains more about the necessity of using Teflon tanks when doing KOK etching. If you have questions or would like a free consultation or quote on equipment to support the KOH etching process, please call 866-803-1533 or send an email to modutek@modutek.com. 

Why Particle Removal is Essential in Silicon Wafer Cleaning

The effective removal of particles and contaminants is vital part of silicon wafer cleaning. Particles and such other impurities that are either deposited on wafer surfaces or are left over from the previous process stages, can cause defects in the final semiconductor product. Even the tiniest particles can block etching and have a negative effect in the diffusion process, resulting in semiconductor circuit that is either defective or having reduced quality and life expectancy.

The goal of all silicon wafer cleaning processes is to leave the silicon wafer surface intact along with removing contaminating particles at the same time. Specialized equipment is required for various cleaning processes which include traditional standard processes that can be used together with new technologies aimed at removing even the smallest particles.

The different cleaning methods which are used at different stages of the silicon wafer fabrication process include the following:

• RCA clean process – consists of two steps: SC1 (which removes organic particles) and SC2 (which removes metallic residues and particles). Each of the steps uses different cleaning chemicals to remove residues or particles.
• Piranha cleaning process – removes large amounts of organic residues such as photoresist. It uses a corrosive mixture of sulfuric acid and hydrogen peroxide, which must be handled with care.
• Megasonic cleaning – removes particles and other contaminants using microscopic cavitation bubbles generated by a megasonic cleaning system.
• The Ozone cleaning process–uses ozone to convert organic particles and contaminants to carbon dioxide. 

Pre-diffusion clean is one of the most critical silicon wafer cleaning processes that takes place just before the wafers are placed in the diffusion oven. Any of the cleaning methods listed above or a combination of these can be used to ensure that wafers are free of particles so diffusion will be even and consistent.

The great news is that Modutek, a company with over 30 years of experience in providing semiconductor manufacturing solutions, offers wet bench technology which supports all of the above-mentioned cleaning methods. Their silicon wafer cleaning systems can come in manual, semi-automatic or fully automatic. They are available in standard configurations but Modutek can also design custom products to meet the client's cleaning specifications.

Silicon wafer cleaning is important for achieving quality wafers. Read the complete article “Why Particle Removal Is Essential in Silicon Wafer Cleaning” for more information. If you have questions or would like to a get a free consultation or quote, call 866-803-1533 or email Modutek@modutek.com.

How Pre-Diffusion Cleans Are Used in the Wafer Cleaning Process

The silicon wafers that are processed in research centers and semiconductor manufacturing facilities must be cleaned repeatedly in aggressive chemical baths that remove surface contaminants from the wafers. This is essential in removing surface impurities which would affect the diffusion of dopants in the diffusion ovens.

Wafers must be completely cleaned and free from impurities, and the wafer cleaning process may involve the following multiple cleaning methods to prepare the wafer for the diffusion stage:

Organic material and photoresist - Wafers may still have photoresist left on the surface, even after undergoing previous stages (such as masking). The photoresist and any related materials need to be removed since they will inhibit the doping process. These materials are removed by procedures that may include Piranha etch (a mixture of sulfuric acid and hydrogen peroxide).

General cleaning and metallic particles - The two-step RCA cleaning process is used to remove light organic contamination from the wafer's surface. The first step SC1, removes the organic contamination from the wafer's surface, while the second step SC2 removes the leftover metallic particles from the wafer's surface and creates a protective layer on the silicon surface.

Native oxide layer removal – The native silicon oxide layer must be removed for some semiconductor fabrication steps. Hydrofluoric acid is commonly used but it is extremely dangerous to handle so it requires a proper and safe set-up. The wafers are typically dipped into the acid (which reacts very quickly), rinsed with DI water and then dried to prepare them to the diffusion oven.

Other cleaning methods – Modutek has pioneered wafer cleaning process equipment and methods that do not use harsh cleaning chemicals. Instead, these methods include megasonic cleaning which uses megasonic sound waves in the cleaning solution to remove particles and impurities in cleaning wafers.

Read the complete article “How Pre-Diffusion CHow Pre-Diffusion Cleans Are Used in the Wafer Cleaning Processleans Are Used in the Wafer Cleaning Process” for further details. You may also contact Modutek at 866-803-1522 to discuss which wafer cleaning process is right for your application or to get a free quote.

How Wet Bench Stations Are Tailored for Specific Manufacturing Process Requirements

The fabrication of semiconductor wafers requires precise, closely controlled, and consistently-repeated procedures. These factors are critically important especially for industries that fabricate semiconductors, medical equipment, and photovoltaic cells. They require the use of custom-made wet benches designed to assist the safe and precise control of corrosive chemicals at high temperatures.

Modutek, with over 35 years of experience in wet bench stations, manufactures a full range of wet bench equipment to address the specific needs of semiconductor manufacturing facilities and research centers. Wet bench stations are tailor made based on the manufacturing requirements of each customer. Modutek’s wet bench equipment for the semiconductor industry meets all UL2360/FM4910 standards for fire and contamination safety.

Sulfuric acid-peroxide is a powerful chemical that is critical to the cleaning process applied to semiconductor wafers. Effective application of this chemical mixture is inherently unstable and therefore it needs to be constantly controlled and re-balanced to maintain efficiency.Modutek’s wet bench equipment ensures the precise chemical concentration levels are maintained and insures the most cost-effective use using an exclusive chemical re-use system.

The silicon nitride wet etching process is another semiconductor fabrication stage that is used to mask chemical etchings on silicon wafers. It also requires high precision and control. Once the etching is successfully done, the masking material should be removed. Precise control of certain chemical mixtures used in wet etching (such as phosphoric acid and DI water) will prevent the possibility of dangerous overheating and explosions. Modutek's wet bench stations are constructed with high-tech safety features and the use of precision software to address such challenges.

Read the complete article titled “How Wet Bench Stations Are Tailored for Specific Manufacturing Process Requirements” for additional information about Modutek’s wet bench stations and process control features. If you have questions or would like to discuss your wet bench requirements, please call Modutek at 408-362-2000 or email modutek@modutek.com.

Advancements in Wafer Fabrication Equipment Improve Semiconductor Manufacturing

The improvements in wafer fabrication equipment have kept up with the growing industry demands in high precision wafer fabrication. Precision is required to ensure adequate output quality and a low component rejection rate.

Automation has become the norm since it requires minimal manual handling. More so, it is needed to meet stringent requirements which allow fabrication shops to boost their productivity, minimize errors, reduce waste, and prevent additional costs.

Modutek offers fully automated wafer fabrication equipment which provides fully automated control of the wafer fabrication process. It has integrated software such as Modutek's SolidWorks Flow Simulation and SolidWorks Simulation Professional which allow operators to calculate process variables and track chemical usage. Once the process is programmed, the advanced robotics will execute the process steps without intervention or monitoring from the human user. This results in a consistent process environment, increased throughput and increased output quality.

Both the software and the robotics have significantly improved process control, reliability and efficiency. Since a lot of semiconductor suppliers have their own requirements for different kinds of wafer manufacturing, Modutek designs the equipment, assembly and testing, and even the software, to match these specific customer requirements.

The last etch process involves etching the silicon wafer to remove the silicon oxide layer and then drying the cleaned wafer in a drying chamber. At this stage, any contamination can negatively affect later processes and will result to semiconductor components of inferior or defective quality. Modutek's newest product introduces the combination of the last etch (HF) and IPA drying chamber to prevent handling the silicon wafer and thus reduce its chances of contamination.

Read the complete article titled “Advancements in Wafer Fabrication Equipment Improve Semiconductor Manufacturing” to learn more about Modutek’s advancements. If you would like to discuss your particular needs, would like to schedule a free consultation, or have questions, call Modutek at 866-803-1533 or send an email to Modutek@modutek.com.

Modutek Named Among Top Suppliers in Global Semiconductor Wafer Cleaning System Market

Modutek, a leading supplier of wet bench technology, wet processing and chemical handling stations, is recently named among the top suppliers in the global semiconductor wafer cleaning system market report, published on eMarkets Europe.

The company has been a semiconductor equipment manufacturer for more than 35 years, and has built a reputation for innovation, in house expertise and high quality customer support. Modutek's wet bench stations support all common chemical process used for wafer fabrication. It has developed its own innovative software and process steps to ensure increased throughput while reducing chances of human errors, costs as well as defective or inferior semiconductor wafers.

Modutek has been supplying high-quality manufacturing equipment that meets the specific needs of a customer’s processing requirements. Their wet bench stations use the latest advanced technology to execute a client’s process precisely. As top supplier, Modutek knows the details of the different etching, stripping and cleaning process and designs equipment and software that will handle these processes efficiently, effectively and safely.

By introducing new and innovative solutions in an ever-changing semiconductor industry, Modutek’s systems allow for increased productivity while reducing costs. Modutek’s products allow customers to maintain or increase yields in the face of challenges from denser component packing and more complex microstructures on silicon wafers.

Apart from the experience, Modutek distinguishes itself through its in-house expertise and experience. The company's engineers develop their own equipment, design the software, which are all assembled and tested in-house. This results to unequaled and exceptional service and support without requiring third parties for additional assistance.

Modutek has been recognized as a leader among the semiconductor equipment manufacturers in their industry. For further details read the complete article titled “Modutek Named Among Top Suppliers in Global Semiconductor Wafer Cleaning System Market”. For a free quote or consultation on selecting the wafer manufacturing equipment for your specific process requirements send an email to modutek@modutek.com or call Modutek at 866-803-1533.

Changes to the SPM Process Improves Efficiency and Results

The sulfuric acid peroxide measure (SPM) is the process that effectively strips and cleans silicon wafers, however due to the decomposition of the hydrogen peroxide it suffers from instability. Heated baths can speed up the process, but they can affect the concentration of the hydrogen peroxide. Periodically adding the mixture with extra hydrogen peroxide, on the other hand, will maintain its concentration but it can affect the strip rate. As a result, the SPM mixture needs to be changed as frequently, and leads to high costs of chemicals and frequent downtime on wet bench stations.

Modutek has addressed the SPM issues with its new “bleed and feed” spiking system, which uses a double clean-and-dirty tank process. This newSPM strip and clean process starts by draining a programmable amount of mixture prior to each process step. Next, a programmable amount of sulfuric acid is added to a clean tank. Now both tanks have the programmable amount of hydrogen peroxide.

With the “bleed and feed” method, a complete chemical change is now only required about once a week as compared to two or three times a day. It also helps in reducing downtime and enables the process to get up again quickly. Result is less frequent changes and use of costly chemicals.

The “bleed and feed” system is also PLC-controlled, and the periodic adding/spiking of chemicals enables the mixture to be used continuously for longer periods of time. In addition this updated process is more efficient in delivering better cleaning and stripping performance.

For additional details about the SPM process upgrade on Modutek’s wet bench stations, read the complete article entitled “Changes to the SPM Process Improves Efficiency and Results.” If you need more information or have questions, please send an email to modutek@modutek.com or call Modutek at 866-803-1533.

Modutek At 2018 Semicon Conference in China

Modutek Corporation, a leading provider of wet bench stations and wet process equipment, will be at the Semicon Conference in Shanghai China from March 14-16, 2018 with their factory representative Laserwort Ltd.  They will be located in Hall N2 at booth 2431. Information about the Semicon Conference can be referenced at http://www.semiconchina.org/ and details on Modutek’s attendance at the conference can be referenced at: Modutek at Semicon Conference in China

Come by the Modutek /Laserwort booth to get information and answer any questions you have about using Wet Bench Process Stations for acid/base, solvent and ozone cleaning or photo resist strip.  In addition Modutek will also provide information about the benefits of their new IPA vapor dryer with the HF last process. Modutek serves customers around the world who require any type of wet processing equipment and builds chemical delivery systems for pharmaceutical, biochemical, solar and semiconductor manufacturing.

Additional details on some of Modutek’s products are listed below:

Single Chamber HF Last IPA Vapor Dryer

Benefits include:

·         Most drying cycles completed within 10 to 15 minutes

·         Very low consumption of IPA

·         No moving parts inside drying chamber eliminating wafer breakage

·         Eliminates watermarks

·         Drying technology can be designed into wet bench eliminating one transfer step

Features include:

·         Single drying chamber for DI water rinsing and IPA vapor drying

·         On board HF metering for precision mix ratios

·         Uses an in situ HF etch process with a rinse step before the IPA drying cycle

·         Filter bypass for contamination control with no cassette contact points

·         Easy to change IPA bottles

·         Handles all process sizes (standard wafer carriers to glass substrates)

Fully-automated Wet Bench Equipment

Benefits include:

·         In house customization to meet customer process requirements

·         Precise automated process execution and reliable repeatability

·         Full automation control with touch screen

·         Improved yield and reduced errors

·         SolidWorks Simulation software for accurate calculation of process parameters

·         All robotics and software design designed in house

·         Complete design, assembly and test at one location to meet your specifications

Semi-automated Wet Bench Equipment:

Benefits Include:

·         Automation control with touch screen

·         Servo motor automation

·         SolidWorks Flow Simulation software

·         SolidWorks Simulation Professional software

·         All robotics and software designed and developed in house

·         Complete design, assembly and test at one location to meet your specifications

Manual Wet Bench Equipment:

Benefits Include:

·         High end manual equipment at competitive pricing

·         Meets or exceeds all current safety standards

·         Low cost of ownership

·         Designed to meet any process requirements

·         Can accommodate custom designs and processes

·         Equipment designed for future expansion

All wet bench equipment supports the following applications:

• KOH Etching
• Quartz cleaning
• Ozone Strip
• Ozone Cleaning
• SC1 & SC2 (RCA Clean)
• Megasonic Cleaning
• BOE (Buffered Oxide Etching)
• MEMs processing
• All solvent applications
• Hot phosphoric (Nitride Etching)
• SPM Cleaning
• Precision Part Cleaning

Modutek has over 37 years of industry experience and expertise in developing and building wet bench stations and wet process equipment that provides highly reliable results for precision processes. They also provide world-class service, and customer support. Contact Modutek at 866-803-1533 or email Modutek@Modutek.com for a free quote or consultation to discuss your requirements.