Fully and semi-automated wafer processing equipment can help improve wafer output quality by providing consistent chemical processing dosages and timing. However process settings must first be determined manually, then in semi-automated mode where the settings can easily be adjusted or fine tuned.
This especially applies to new process development where the exact parameters are yet to be determined. Wafer fabrication facilities may try out the initial settings first in manual mode and make some appropriate adjustments. Then they may automate some of the processes using semi-automated stations for parts of the process that are finalized while making additional manual adjustments for optimize results. The final processing parameters can then be implemented in a fully automated station.
After the initial run, the problem areas can be identified, and variables such as chemical dosages and timing can be revised and adjusted. Skilled and experienced operators can do the fabrication steps and make changes easily on the manual station. In manual mode operators has complete control of the process. This control is important for determining the initial settings of a new process.
When the changes have been finally made on the major parts of the new process, there may still have some necessary minor adjustments necessary to achieve targets such as faster processing, better quality output or reduced usage of chemicals. For this reason, the semi-automated stations can be used to save time.
Once the parameters and variables for the desired yield and performance have been determined, a tailor-made software and automation package can be assembled. These packages are implemented in fully automated wafer processing equipment which can reproduce the custom settings of the manual and semi-automated process steps and use them to produce the desired results consistently.
This especially applies to new process development where the exact parameters are yet to be determined. Wafer fabrication facilities may try out the initial settings first in manual mode and make some appropriate adjustments. Then they may automate some of the processes using semi-automated stations for parts of the process that are finalized while making additional manual adjustments for optimize results. The final processing parameters can then be implemented in a fully automated station.
After the initial run, the problem areas can be identified, and variables such as chemical dosages and timing can be revised and adjusted. Skilled and experienced operators can do the fabrication steps and make changes easily on the manual station. In manual mode operators has complete control of the process. This control is important for determining the initial settings of a new process.
When the changes have been finally made on the major parts of the new process, there may still have some necessary minor adjustments necessary to achieve targets such as faster processing, better quality output or reduced usage of chemicals. For this reason, the semi-automated stations can be used to save time.
Once the parameters and variables for the desired yield and performance have been determined, a tailor-made software and automation package can be assembled. These packages are implemented in fully automated wafer processing equipment which can reproduce the custom settings of the manual and semi-automated process steps and use them to produce the desired results consistently.
Modutek can work closely with a customer to determine the best way to optimize a new process. For more details read the complete article, “Improving Wafer Processing with Automated Equipment.”If you have questions or would like a free consultation to discuss your specific needs call 866-803-1533 or email Modutek@modutek.com.
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