How the Advanced Ozone Cleaning Process Improves Wafer Yields and Reduces Costs

Modutek's advanced ozone cleaning process is a better alternative to the traditional wafer cleaning methods and reduces chemical use.

The ozone cleaning process involves the use of ozone which converts organic residue on wafers into carbon dioxide through oxidation. This process effectively cleans wafers so they are free of contaminants. Modutek's advanced ozone cleaning process leads to improved silicon wafer cleaning and reduced use of harmful cleaning chemicals.

How does the ozone cleaning process work?

Modutek DryZone gradient dryer uses DI water to rinse away organic impurities from the wafer before the wafer is exposed to ozone. The Coldstrip ozone cleaning method cleans at sub ambient temperatures while the Organostrip cleans at room temperature.

The ozone has a powerful oxidizing action which converts carbon impurities of organic residue to carbon dioxide. This results into wafers that are clean and free of particles.

Modutek's advanced ozone cleaning process can be used with plain water or just a mild solvent. It doesn't rely on harsh cleaning solvents, unlike other traditional cleaning methods. The wastes resulting from the advanced ozone cleaning process are harmless to the environment, while it maintains its superior cleaning performance.

It is also cost-effective: the equipment, processing, shipping, handling and disposal costs are greatly reduced compared to those in other cleaning processes such as Piranha (which, for instance, requires several cleaning tanks, some of which use cleaning solvents). Modutek's advanced ozone cleaning process doesn't require adherence to strict regulations since it uses very eco-friendly methods.

If you have questions, you may contact Modutek by email Modutek@modutek.com to learn more or read the complete article titled “How the Advanced Ozone Cleaning Process Improves Wafer Yields and Reduces Costs.”