Using the Advanced Ozone Cleaning Process to Improve Wafer Yields

Wet process semiconductor manufacturing is sensitive to wafer contamination by microscopic particles that increase the chances of final product rejection rates and reduced output quality.

The traditional ways of removing particle contaminants from silicon wafers during wet bench processing includes the use of expensive and toxic chemicals. However, the ozone cleaning process is a better alternative as it can reduce particle counts and improve wafers yields. At the same time, cleaning organic contaminants from the wafer with ozone reduces the use of expensive and toxic chemicals.

Modutek’s Advanced Ozone Cleaning Process allows semiconductor manufacturing facilities to increase throughput and output quality while reducing operating costs. It uses ozone to remove organic contaminants from the surfaces of silicon wafers during wet bench processing. Reduced particle counts are needed for the more compact architecture of modern semiconductors where a single particle can cause defects or components of lower quality.

Ozone is used with either room temperature acidic acid or chilled de-ionized water to clean wafers without harsh and aggressive chemicals. Apart from saving money because of the reduced use of chemicals, ozone cleaning also takes less space and is faster than many chemical-based wet bench processes.

Modutek’s DryZone System uses ozone cleaning. The company has developed the Coldstrip sub ambient process and the Organostrip process that operates at room temperature. Both ozone cleaning process deliver reduced particle counts and increased yields.

Coldstrip sub ambient process – it operates at four to ten degrees centigrade and introduces ozone into the ozone chamber after the wafers have been rinsed with DI water. The rinsing removes non-organic contamination while the ozone combines with the organic contaminants to produce carbon dioxide. Once this process is complete, the wafers are clean and nearly free of particles.

Organostrip process – the wafers are rinsed with acidic acid containing ozone. The acidic acid used has extremely high ozone solubility and the high ozone level produces rapid decomposition and oxidation. The ambient temperature process eliminates the use of harsh and toxic chemicals and the process waste products are harmless.

As a leader among semiconductor equipment manufacturers, Modutek will work with you to supply the equipment you need.

Read our complete article, Using the Advanced Ozone Cleaning Process to Improve Wafer Yields, to learn more. If you have questions or would like to set up a free consultation to discuss your needs, call Modutek at 866-803-1533 or email Modutek@modutek.com.