How Megasonic Cleaning Improves Silicon Wafer Manufacturing Results

Semiconductor components that include processors, switches and memory chips have become so miniaturized, that even sub-micron foreign particles can block the formation of a conducting path or other key structural components. That is why removal of sub-micron particles during the manufacturing process is crucial to avoid defective products. These particles are usually removed by traditional cleaning and rinsing using aggressive chemicals. However, megasonic cleaning is the better alternative option in cleaning silicon wafers because it can remove even the tiniest particles.

Megasonic cleaning uses megasonic sound waves to remove contamination from surfaces of parts being cleaned. The sound waves in the cleaning solution create microscopic bubbles in the wave pressure troughs and collapse them in the wave peaks. When a bubble collapses, it discharges a tiny but powerful and energetic jet of cleaning solution that dislodges contaminants and particles from part surfaces. Modutek has partnered with Kaijo Shibuya Corporation, a world leader in Megasonic and ultrasonic cleaning systems, to create a line of Megasonic cleaning equipment suitable for use in semiconductor manufacturing.

Megasonic cleaning uses a wide range of frequencies. The right selection of frequencies is the key to optimum cleaning performance. Lower frequencies are used for less fragile devices, while higher frequencies are suitable for gentle cleaning of the more delicate parts or parts with soft surfaces.

And because semiconductor components often include very delicate structures and soft layers of deposits on the surface, only the highest frequencies deliver gentle cleaning to avoid damage and pitting to these fragile structures.

Modutek’s Megasonic cleaning system can clean at frequencies between 200 kHz and 2 MHz but generally operates at 950 kHz. The system delivers up to 1200 W of cleaning power and can operate with bath temperatures of up to 140 degrees centigrade. The system offer superior performance and can removal rate for particles down to 0.1 microns which improve semiconductor component yields, reduces the number of defective components and improves product quality.

For more details read the complete article “How Megasonic Cleaning Improves Silicon Wafer Manufacturing Results”. If you have questions after reading the article, or would like to set up a free consultation, contact Modutek at modutek@modutek.com or call 866-803-1533.