Modutek
Corporation has just received a customer order for a new innovative IPA vapor dryer. It includes HF
(hydrofluoric acid) injection as a first procedure before moving on to the standard
IPA vapor drying process. This step leads to the oxide etch to bare silicon.
The hydrophobic wafers are then rinsed to pH controlled level. When the pH
reaches the appropriate level, the IPA vapor dry process starts in the same
chamber. This eliminates the need to move the Hydrophobic wafers to a separate
drying station. The new IPA vapor dryer improves yields by minimizing or
entirely removing water spots and reduces the defects by particle
neutral-drying.
Modutek’s IPA vapor
dryer features a
single drying chamber for DI water rinsing and IPA vapor drying. It also has an
onboard HF metering which controls mix ratios with precise measurements. The oxide
etch with the IPA vapor drying uses a process with rinsing controlled pH before
the IPA drying cycle starts. It also includes a filter bypass for contamination
control. The IPA vapor's standard one-gallon bottles are also easy to change at
deck level and the top entry of the IPA vapor guarantees even distribution. The
absence of moving parts in the dryer will ensure no breakage of the wafer.
Modutek's
dryer cycles last from 10 to 15 minutes and has reduced consumption on IPA.
Modutek also does custom installations and thus can do designs of the IPA dryer
to meet various requirements of any application. The entire press release
article can be read from the following link: http://www.modutek.com/modutek-receives-order-for-single-chamber-hf-lastipa-vapor-dryer/
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