Silicon Wafer Cleaning: Effectively Removing Contaminants to Improve Yields

The key to successful semiconductor manufacturing is the effective cleaning of silicon wafers during various stages in the manufacturing process. The equipment and processes used in silicon wafer cleaning needs to effectively remove impurities, contaminants, and residues to ensure that the manufactured components meet the required functionality and quality. Modutek’s silicon wafer cleaning equipment helps to optimize yields and uses the most advanced cleaning processes to produce high-quality results.

RCA Cleaning - Consists of immersion of the silicon wafers in hot acidic acid and alkaline cleaning solutions.

Megasonic Cleaning - Complements RCA Cleaning with the use of megasonic cleaning technology that produces cavitation bubbles to remove microscopic particles that create component defects.

SPM Clean-Piranha Etch – This is used in cleaning heavily contaminated and clearly visible contaminants in silicon wafers. Hydrogen peroxide and sulphuric acid are the cleaning solutions.

FFEOL and BEOL processing - Front End of Line (FFEOL) processing is a part of semiconductor manufacturing where the components are created in a semiconductor wafer. The Back End of Line (BEOL) involves depositing the metallic interconnections.

Modutek specializes in silicon wafer cleaning equipment for the semiconductor manufacturing industry and provides a complete line of semiconductor cleaning solutions. In addition to chemical cleaning stations Modutek incorporates the use of Megasonic cleaning equipment and IPA vapor dryers. You may learn more about “Silicon Wafer Cleaning: Effectively Removing Contaminants to Improve Yields” by reading the blog article on the site.