Single Wafer Processing Spurs Demand for Wafer Cleaning Equipment

Wafer cleaning equipment suppliers regularly invest heavily in research and development in order to stay abreast of the ever-changing market trends. It also helps them meet the high demands of certain industries such as semiconductors, printed electronics, and single wafer processing.

More and more operators are jumping into the semiconductor equipment industry. Thus, the trend fuels the high demand for wafer cleaning equipment.

Single wafer processing is one of the factors that drive the global wafer cleaning equipment market's continuous growth. Single wafer processing uses ozonized wafer and hydrofluoric acid in a single spin technology to reduce cycle times and boost output flexibility.

Single wafer cleaning equipment becomes competitive but only when the cycle times for individual wafers are low and the quality of the output can be comparable to wet batch processing. It can be used to etch silicon and provide a wet process for mini-fab single wafer cleaning. This process is often done together with megasonic cleaning because it helps in removing the tiniest particles and impurities, resulting in low particle count for the finished substrate.

Some single wafer processes are attractive because their deliver better results than the use of traditional process. The use of megasonic cleaning in particular reduces particle counts for even the smallest particles. The cleaning method uses megasonic sound waves in the cleaning solution which generate cavitation bubbles. These bubbles can remove the very small particles from the substrate surface. This type of cleaning is better than the traditional methods as it uses no harsh chemicals and reduces particle counts.

As semiconductor equipment manufacturers embrace single-wafer processing, the demand for single wafer cleaning equipment will increase significantly.

For more information read the complete article “Single Wafer Processing Spurs Demand for Wafer Cleaning Equipment”. If you would like a free estimate or have questions, contact Modutek by email to Modutek@modutek.com or by calling 866-803-1533.

Advantages of HF-Last Etching and IPA Drying in One Chamber

After cleaning, a silicon wafer needs to be effectively cleaned and dried with no particle contamination. Clean wafers are important to avoid errors in the next processing steps to produce devices that are of superior quality and free from defects. Using the single chamber HF-last and IPA vapor dryer show a considerable reduction in wafer substrate particle counts.

By the final stage of silicon wafer cleaning, the silicon oxide layer has to be removed and the cleaned wafer dried free from contaminants. However, transferring the wafers from the HF etching process to a separate drying chamber will likely cause the wafers to pick up particles.

Modutek now has a solution to this problem: the single-chamber HF-last and IPA vapor dryer, which can help to significantly reduce the particle count on wafer substrates.

In the single chamber process, Modutek uses IPA vapor drying in a free-standing unit with one DI water rinsing and drying. This method, also called the Marangoni drying technique, results in clean wafer substrates -- having no contamination or watermarks.

Modutek has modified the IPA vapor dryer to include HF (hydrofluoric) acid injection before the start of the standard IPA vapor drying process. The HF acid injection ratio is controlled and provides an etch to bare silicon. When the silicon is etched, it is then rinsed to a controlled pH level. Once the appropriate pH levels are reached, it is then followed by the IPA drying process without moving the silicon wafers. This results in the low particle count on the wafer.

Initial field results from the single chamber HF-Last IPA dyer that Modutek has supplied to customers are showing outstanding results. Within the 0.3 to 5 micron range, fewer than 20 particles (adders) were added to etched substrates which are substantially below what was achieved in previous processes in this field trail.

For more details read the complete article “Advantages of HF-Last Etching and IPA Drying in One Chamber” to learn more about Modutek’s IPA vapor dryers. Call Modtuek at 866-803-1533 or send an email to Modutek@modutek.com if you have questions or would like to get a free consultation.